David Bieniak
Huntsman
Advanced
Materials
Australia
Victoria, Australia
Edited by Jean M. Hoffman
Plastic replacements for metal parts and
assemblies are a hot topic these days. Automotive
and aerospace manufacturers use
plastics to cut weight and boost fuel efficiency.
Similarly, plastics are used to make
durable, easy-to-mold, lightweight housings
and internal components for other
industries as well.
The preferred way to assemble plastic
parts is through adhesive bonding rather
than mechanical fastening. Adhesive joints
are aesthetically pleasing and free from
deformations due to welded joints or any
mechanical attachments. Adhesive bondlines
are continuous and “leakproof.” And
they resist corrosion better than other assembly
methods. Continuous bondlines
also withstand concentrated stresses better
than spot-welded or mechanically fastened
joints. In addition, adhesive bonding turns
out parts with good vibration damping and
simplifies assembly when a single bond replaces
several mechanical fasteners.
However, there are some tricks of the
trade for bonding plastics. All substrates
should be degreased and, typically, lightly abraded before bonding. But the way to get
the maximum strength and long-term resistance
to deterioration is through a chemical
or electrolytic pretreatment, particularly on
thermoset and thermoplastic surfaces.
Polymeric substrates
Molded, cast, and laminated parts
made f rom thermos et plastics such
as glass-reinforced epoxy (GRE), glass
and carbon-reinforced plastic (GRP and
CFRP), and sheet-molding compound
(SMC) usually bond without difficulty.
Of course joint surfaces must be free of
all dirt and residual release agent before adhesive is applied. Abrasion with emery cloth,
grit-blasting, and cleaning with a solvent such as
acetone are all good practices.
Thermoplastics, by contrast, are more difficult to
bond. Each type of plastic ABS, polycarbonate (PC),
polyvinyl chloride (PVC), polypropylene (PP), polyethylene
(PE), polymethyl methacrylate (PMMA),
polyamide and polyetheretherketone (PEEK) may
vary considerably in properties that determine bond
strength.
Bonds are stronger with properly prepared surfaces.
Pretreatment removes low-surface-energy contaminants
such as waxes, oils, greases, plasticizers, and release agents. Proper preparation also
reduces dust, dirt, and loose particles resulting
from abrasion. Substrate pretreatment
expands the surface area available for bonding
by creating textured surfaces.
In addition, surface prep promotes the
thorough adhesive wetting needed for strong
bonds. It does so by giving the material being
bonded higher surface energy than that
of the adhesive.
Metal substrates exhibit much higher
surface energies than polymers. As a result,
they are easier to wet-out and bond with
adhesivelike epoxies that have surface energies
of around 40 mJ/m2. Conversely, polymers
don’t wet-out as well because their
surface energies are slightly lower than
those of epoxy adhesives. That’s why their
surface energy must be raised to
get a strong bond. A variety of
techniques can accomplish this.
These methods also help produce
joints that better withstand moisture
and aggressive chemicals
without disbonding.
In most cases, abrading surfaces
and wiping them with a solvent
such as acetone, ethanol, or isopropanol
will be enough. But certain
plastics may need flame, corona,
or other chemical pretreatments to
change their surface textures.
Solvent wipe is the simplest
form of surface preparation and
is ideal for removing waxes, oils,
and other low-molecular-weight
contaminants from substrates. The
technique relies on the contaminants
being soluble in the solvent
and the solvent itself being free of
dissolved contaminants. But some
solvents aren’t compatible with particular
polymeric substrates. Some
solvents dissolve thermoplastics
or will create stress cracking or crazing on surfaces. Common solvents are acetone, MEK, MIBK,
Xylene, TCE, ethanol, and IPA.
Apply solvents with clean, lint-free cloths or paper
towels. Take care to prevent cross-contamination
from sample to sample by not reusing cloths or dipping
a contaminated cloth dipped into the solvent.
It’s also important to monitor for hazardous and
toxic-vapor buildup when using solvents. Solvent
wiping is not suitable for large-scale bonding projects.
Instead, vapor degreasing or ultrasonic vapor degreasing
are more appropriate.
Abrasion can be accomplished several ways. Manual
abrasion includes wire brushing, paper sanding, and filing. Automated
techniques include highspeed
sanding, grinding,
and shot/grit blasting.
Mechanical/automated
abrasion processes are
relatively quick and economical.
They are also
reproducible and depend
less on skilled labor than
manual methods.
Flame treatment partially
oxidizes surfaces,
producing polar groups
that raise the polymer’s
surface energy. This technique
uses a gas or gas/
oxygen flame. It works
well for uneven profiles eand
thick substrates. It is easy to
adjust and control the gas/oxygen
ratio, flow rate, exposure time, and
proximity of flame to the substrate.
It is an effective method for use on
PE and PP. Thinner substrates are
better suited to corona pretreatment
as described below.
Plasma treatment, as the name
implies, uses a plasma created by charging a gas with a high amount
of energy. The free ions and electrons
in the plasma clean the surfaces
of any material it touches.
On organic surfaces, plasmas, like
flames, create polar groups/active
radicals that boost surface energy
and aid adhesion. Low-pressure
plasma is a technique that involves
exciting a gas with the high frequency and high voltage between
two electrodes in a lowpressure
chamber. The process
uses various plasmas of argon,
ammonia, nitrogen, or oxygen,
which make it suitable for a wide
range of substrates.
With low-pressure plasmas,
air can serve as the plasma
source. In this case, oxygen in
air produces the greatest results
because it reacts with carbohydrate-
based contaminants and
breaks up large-chain molecules.
The process readily removes
smaller molecules. Handheld
and automated devices are available
for the method. Some devices
can be fit to a robotic head
so adhesives can go on immediately
after pre-treatment. The
process creates surfaces with energies
greater than 70 mJ/m2 in
many cases.
Low-pressure plasma has an
active bandwidth of 0.5 in. It can
be used at up to 3,000 fpm and is
a candidate for large industrial applications. Among the plastics
suitable for treatment with
low-pressure plasma are PP, PE,
polyamide, PET, ABS, PC, rubber
and composites.
Corona discharge works like
low-pressure plasma in principle,
but events take place in
air at atmospheric pressure. A
corona is generated by applying
high voltage (up to 30 kV) at frequencies ranging from 9
to 50 kHz to an electrode separated
from a grounded table by
an air gap. At 3 to 5 kV/mm, a
current passes through the air
gap to generate free electrons
which move toward the positive
electrode with great energy. The
free electrons displace electrons
from molecules in the air gap
and, in turn, create more free
electrons. The corresponding
ions contribute to current that
flows across the gap. As ionization
currents rise, the corona
discharge rate also increases
(i.e., the particles move faster).
The resulting plasma then activates
the surface of the plastic
part onto which the discharge
is directed. Corona discharge
is especially well suited for thin
films and composite laminates.
Chemical treatment works
well for bonding polymeric
substrates. These treatments
are usually applied by polymer
manufacturers or companies
specializing in chemical pretreating.
Treatments used for
polymers include etchants for
PTFE, caustic soda etching for
polyesters, proprietary primers
for PP, sulfuric acid for PS, and
the Sicor process for thermoplastics.
Sicor was developed
by Commonwealth Scientific
and Industrial Research Organisation
(CSIRO) in Australia,
primarily for the automotive
industry.)
Finally, the choice of adhesive
also makes a difference.
For example, adhesives based
on methacrylate often produce
durable joints even on poorly
prepared substrates.
Make Contact
Huntsman Advanced Materials,
Australia Pty. Ltd.
+61 3 9361
6060
huntsman.com/advanced_materials
Bonding Basics
In addition to surface treatment, several processing parameters are
critical for successful bonds.
-
Resin and hardener must be precisely proportioned and thoroughly
mixed before application.
-
Curing temperatures and times must be correct.
-
Jigs and other fixtures should securely hold bonded surfaces during
curing and eliminate any movement before the part attains
handling strength.
-
Bonded surfaces need only light pressure during assembly as the
adhesive cures. But pressure should be applied as evenly as possible
over the entire bond area. But excessive pressure can force
adhesive to run out, leaving a joint starved of adhesive. Under lab
conditions, pressure applied is generally 30 to 50 N for a bonding
area of 0.625 in.2 (312.5 mm2). This figure may change for highviscosity
adhesives.
Though it may sound obvious, durable joints must be designed
properly. To begin, engineers must evaluate all the forces that will act
on the bond line such as shear, tension, or compression. Butt joints
and bond lines that will see peel and/or cleavage forces should be
avoided. In addition, a glue line of 0.002 to 0.008 in. (0.05 to 0.2 mm) is
best for optimum adhesive strength, although many thixotropic/paste
adhesives can fill some of the gap between two substrates.
Finally, adhesive selection depends on operating conditions. An
assembly subjected to vibration or impact, for example, should use a
toughened adhesive. Adhesive choice should also account for service
conditions. Loading, temperature, and other environmental factors
can all have major effects on bond strength. |
Pretreated Versus Untreated Plastics
Huntsman recently compared solvent wiping to plasma treatment of
polymeric substrates. Plasma treatment significantly improves lap shear
strength of epoxy, methacrylate, and polyurethane adhesives. This improvement
can be expected to translate into more durable joints, but findings
have yet to be verified with long-term testing. |