Product Spotlight: Flexible, Low-Viscosity Potting Compound
A new flexible, tough epoxy potting and encapsulation compound called EP30FL can be used in both thick and thin cross sections.
It is 100% reactive and contains no volatiles.
The compound generates low exotherm during
cure even though it cures relatively quickly at
room temperature. Its cure shrinkage is low and it
bonds to similar and dissimilar substrates. Because
of its flexibility it’s a candidate for use in environments
exposed to thermal cycling. Additionally it
can withstand mechanical shock and vibration, is
water resistant, and in the cured state can serve as
an electrical insulator. The compound comes in half
pint, pint, quart, gallon, and five gallon kits.
Master Bond Inc.
154 Hobart St.
Hackensack, NJ
07601
(201) 343-8983
masterbond.com