Cool Running

Feb. 8, 2007
Thermal-management devices made from metal-matrix AlSiC (aluminum-silicon-carbide) composites have tailorable, isotropic coefficient of thermal expansions (8.75 to 11.7) and low densities (2.86 to 3.01 gm/cm3).

Thermal-management devices made from metal-matrix AlSiC (aluminum-silicon-carbide) composites have tailorable, isotropic coefficient of thermal expansions (8.75 to 11.7) and low densities (2.86 to 3.01 gm/cm3). The composites easily cast to near-net shapes with a thermal conductivity on the order of 1,000 W/mK. Devices made from the composites can also incorporate features such 5-mm-tall pin fins to improve thermal management.

CPS Corp.,
111 S. Worcester St., Chartley, MA 02712,
(508) 222-0614,
alsic.com

 

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