Machine Design

Epoxy For Cryogenic Applications

Two component EP29LPSP epoxy withstands temperatures as low as 4°K (–452°F). Additionally, it resists cryogenic shocks due to going from room temperature down to liquid-helium temperatures in 5 to 10 min.

EPOXY FOR CRYOGENIC APPLICATIONS

Two component EP29LPSP epoxy withstands temperatures as low as 4°K (452°F). Additionally, it resists cryogenic shocks due to going from room temperature down to liquid-helium temperatures in 5 to 10 min. The optically clear epoxy bonds to a variety of substrates including metals, glass, ceramics, and plastics. It has a mix ratio of 100:65 by weight

and a mixed viscosity of 400 cps. The adhesive cures at room temperature with low exotherm, but best results come when cured at 130 to 165°F for 6 to 8 hr. EP29LPSP has a tensile strength of 6.5 kpsi, a tensile modulus of over 375 kpsi, a volume resistivity of greater than 1015, and a dielectric constant of 3.6. The epoxy comes in pint, quart, gallon, and 5-gallon kits, as well as syringe applicators.

Master Bond, 154 Hobart St., Hackensack, NJ 07601, (201) 343-8983, masterbond.com

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