EP21TDCSFL two-component, room-temperature-curing, silver-filled, epoxy has a 1:1 mix ratio by weight or volume and can be applied on vertical surfaces with minimal sagging. It cures at room temperature or more rapidly at elevated temperatures and is 100% reactive. The adhesive has elongation over 60%, tensile shear strength over 1,500 psi, T-peel strength over 30 pli, volume resistivity over 10-3 ohm-cm, and thermal conductivity of 11 BTU/in/ft²/hr/°F. It works between 4 K and 250°F.
EP21TDCSFL has low shrinkage and bonds metals, glass, ceramics, rubbers and many plastics as well as dissimilar substrates that are being thermally cycled and shocked. The adhesive comes in half-pint, pint, quart, and gallon kits as well as premixed and frozen syringes.
Master Bond Inc., 154 Hobart St., Hackensack, NJ 07601, (201) 343-8983, www.masterbond.com