Machine Design

Thermal-conductive compound

Tra-Bond 2151 is a thixotropic, heat-conductive, electrically insulating compound.

The two-part adhesive reportedly develops strong, durable bonds and can be roomtemperature or heat cured. The rigid compound is suited for staking transistors, diodes, resistors, integrated circuits, and other heat-sensitive applications. Its coefficient of thermal expansion permits bonds to many materials, including metals, silica, alumina, ceramics, glass, and plastics. Tra-Bond 2151 also passes NASA's outgassing specifications.

Tra-Con Inc.
45 Wiggins Ave.
Bedford, MA 01730
(800) TRA-CON1
tra-con.com

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish