The 10 Key Challenges In Electronics Thermal Design

The 10 Key Challenges In Electronics Thermal Design

Sponsored by Mentor Graphics

Miniaturization of electronics is continuing to increase power densities at all packaging levels. Miniaturization arises from cost reduction, being the key driver in many industry sectors, resulting in increasingly tighter design margins and less tolerance of over-design. 
How should engineering managers engaged in developing products ensure the thermal performance of their products while meeting other design criteria? 


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