Machine Design

Thermal gap pads connect hot chips to heat sinks

Managing thermal loads in modern chip designs just got a bit easier, especially the task of connecting chips with their heat sinks.

 

Engineers can now choose from three S-Class thermal-conductive gap pads from The Bergquist Co., Chanhassen, Minn. (www.bergquistcompany.com). The 2000S40, 2500S20, and 3000S30 materials have thermal conductivities of 2, 2.4, and 3 W/mK, respectively. They are available from 10 to 125-mil thick and can be delivered as sheets or die cut to match specific components or shapes. When placed atop chips and other circuit-board components, they bridge the gap to the heat sink. The materials are a laminate of a compliant resin with embedded-glass reinforcements on the top layer to resist punctures, shear, and tears. The lower layer is naturally tacky rubber, eliminating the need for additional adhesives that may degrade thermal performance.

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish