Date: Wednesday, November 29, 2017
Time: 2:00 PM Eastern Standard Time
Duration: 1 Hour
Sponsored by: COMSOL
If you are interested in simulating the assembly and failure of adhesive joints, then tune into this webinar with Mark Oliver from Veryst Engineering.
For sophisticated applications of adhesives, simulation can be a powerful tool for improving assembly processes by predicting adhesive flow and cure as well as improving joint design by predicting mechanical failure modes.
In this webinar, we will share two examples of using the COMSOL Multiphysics® software to simulate adhesive joints. The first example will be a simulation of the flow, surface wetting, and thermal cure of an adhesive during thermocompression bonding. We will focus our discussion on tracking the degree of adhesive cure during the bonding process. The second example will be a simulation of debonding in an adhesive joint under an applied load. Our focus will be on defining and calibrating the decohesion behavior of adhesive interfaces.
At the end of the webinar, you can ask questions during the Q&A session.
Mark Oliver is a senior engineer at Veryst Engineering, LLC. Dr. Oliver has expertise in the structure and mechanical behavior of engineering materials and has worked extensively in the testing, modeling, and failure analysis of adhesives. He holds a PhD in materials science and engineering from Stanford University. Prior to joining Veryst, Mark worked as a research scientist developing adhesives for the microelectronics industry.
Henrik Sönnerlind has managed structural mechanics development at COMSOL since 2010. With a background as a consultant, he has many years of experience in engineering analysis for the automotive, nuclear, and telecom industries. He graduated from KTH in Stockholm in 1981, specializing in continuum mechanics and numerical methods.