Machine Design

Low-K resin for 300-mm process modules

Formulations of Silk semiconductor low- dielectric for 300-mm semiconductor manufacturing handle processing changes needed to reach uniform, stable films on large-diameter wafers. Silk resins help increase chip speed and performance by providing greater density. First-generation Silk resins offer of 2.6 for copper damascene and aluminum/tungsten processing.

Dow Chemical Co., Box 1206, Midland, MI 48641, (800) 441-4369.

TAGS: Materials
Hide comments


  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.