Motion System Design
PACK EXPO welcomes IOPP as conference partner

PACK EXPO welcomes IOPP as conference partner

PMMI announces that the Institute of Packaging Professionals (IoPP) will present The Packaging Learning Center conference program at PACK EXPO International 2010, to be held October 31 to November 3 at McCormick Place in Chicago. The program, which runs November 1 to 3, includes sessions that will focus on topics ranging from sustainability to food safety. End users, industry consultants, and suppliers will lead the sessions, open to all show attendees. Details are available on, under the Conference tab.

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