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Motion System Design

Technical seminars slated for Pack Expo

The CAMA group, consisting of Dorner, FOX IV, Morrison, and Spee-Dee, will host a series of seminars on trends, innovations, and best practices in the packaging industry in Booth 3854 at Pack Expo, to be held Oct. 31 to Nov. 3 at McCormick Place in Chicago. Called Pack Tech Sessions, the seminars will offer attendees direct access to packaging leaders (development directors and university professors) and a broad discipline of knowledge across the packaging industry. Sessions offered by CAMA will provide technical, non-selling presentations by industry experts and are open to all Pack Expo attendees, although pre-registration is recommended. For more information on Pack Expo, visit

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