Optimizing Precision Motion Control for the Semiconductor Industry

This technical paper details how innovative solutions are optimizing precision motion control for critical semiconductor processes like wafer inspection and lithography. We explore the architectural shift toward embedded control, utilizing an innovative motion control-on-a-chip technology to achieve compact, high-performance stage designs. Key technical aspects covered include the use of Field-Oriented Control (FOC), decoupled control loops, and integrated biquad filtering to suppress mechanical resonances and ensure nanometer-scale precision and stability. The paper further discusses the benefits of S-Curve profiling for maximizing throughput and the role of advanced tuning tools, such as predictive feedforward and Bode plot analysis, in delivering industry-leading move/settle performance and reliability for OEM instrument integration.