This whitepaper examines how modular, low profile, bearingless encoders designed for high volume OEM applications compare. The comparison is based on the design and performance characteristics of each functional element within encoder assemblies. Some of the key components include photodiodes, sensors, discs, casing materials, air gap and alignment characteristics. The considerations related to ease of assembly are covered as well. A list of benefits related to each component in the system is offered in chart form for easy understanding.