Lee Teschler served as Editor-in-Chief of Machine Design until 2014. He holds a B.S. Engineering from the University of Michigan; a B.S. Electrical Engineering from the University of Michigan; and an MBA from Cleveland State University. Prior to joining Penton, Lee worked as a Communications design engineer for the U.S. Government.
Leland’s Recent activity
Berry Plastics Group Inc. has developed a fully recyclable cup that has the same thermal insulative properties as a polystyrene foam cup.
Better conveying efficiency is a highlight at the booths of conveying suppliers such as Emerson Industrial Automation.