The Association of Packaging and Processing Technologies (PMMI) announced that it will award $30,000 a year in scholarships to six college students attending PMMI partner schools. Applicants should be studying engineering, mechatronics, packaging, processing, or a related field, and have at least 1 more semester left of school, plus a minimum 3.0 GPA.
A portion of the $5,000 scholarships are from proceeds raised at the Pack-Gives-Back events organized at the Pack Expo International and Pack Expo Las Vegas.
"This scholarship program demonstrates PMMI's continued commitment to foster our industry's future workforce," says PMMI chief operating officer, Jim Pittas. "We look forward to raising some serious money at our PACK EXPO trade shows to invest in the future of the packaging and processing community through the PACK EXPO Scholarship program."
Students at PMMI-Partner schools that are interested in applying can submit a 500- to 1,000-word essay describing their career goals in alignment with the packaging and processing industry. They will need to include a PMMI-school transcript to indicate their GPA, information about extracurricular activities, and a recommendation signed by a faculty member.
Download the application here.