Congratulations again to the Boilermakers at Purdue University for winning our 2016 Engineering Bracket Challenge. They emerged from a distinguished group of 32 engineering schools as the top vote-getter and received recognition as one of the most admired engineering schools in the United States.
As a reward, all the engineering students at Purdue are eligible to participate in the “Connect the World Using IoT” design challenge, which is backed by three engineering powerhouses—Digi-Key, Texas Instruments, and TE Connectivity. The students have until June 4 to submit a design that works with the Internet of Things. The design must also incorporate a Texas Instruments TM4C123G Launch Pad, a microprocessor that works with a variety of peripherals and IoT applications, and at least one component from TE Connectivity, a company that makes sensors for pressure, position, humidity, and temperature. The students also have to save the design in Scheme-It from Digi-Key, an online schematic and block diagramming tool for electronic circuits
After June 4, a panel of judges made up of engineers from the sponsors and the Electronic Design and Machine Design editorial staffs will evaluate the submissions and award at least three prizes. First-place design wins an Apple Macbook Pro, second place earns an Apple iPad Air, and third place gets a GoPro Hero4 Session camera.
Once the competition is over, I will share the winning entries with you, along with some of the judges’ comments.
