It’s That Time Again: The Fourth Annual Engineering Bracket Challenge

Over the next five weeks or so, readers of Machine Design and Electronic Design, as well as a host of interested engineering students, will be voting for their favorite engineering colleges. Over five weeks of voting, they will winnow down a field of 32-top-notch schools to just one.

The winning school will then enjoy a day of interesting and compelling engineering shows and challenges, product demonstrations from sponsors, free food, and non-stop gift giveaways of iPads, Fitbits, Apple watches, and gift cards. One of the top prizes, for example, is an InstaLab kit from Digi-Key. The $2,000 kit contains just about everything budding engineers need to tinker and experiment in their basement (or attic) lab. The grand prize giveaway at the event will be an all-expense trip to a Maker Fire in San Francisco (May 2019).

Those voting can also pocket some prizes, as long as they continue to vote in each of the five rounds.

Sponsors for this year’s extravaganza include Digi-Key, Reneseas, TE Connectivity, Nordic Semiconductor, Maxon Motors, Texas Instruments, and Alltech Inc.

The entrants in this year’s Bracket Challenge include:

Massachusetts Institute of Technology (MIT)

Cornell U.

U. of California Los Angeles

California Institute of Technology

Stanford U.

Princeton U.

U. of Southern California

Georgia Institute of Technology

U. of California-Berkley

Purdue U.

Columbia U.

U. of Michigan

U. of Illinois

U. of Texas

U. of California-San Diego

Carnegie Mellon U.

U. of Minnesota

Johns Hopkins U.

U. of Wisconsin

Duke U.

Penn State U.

Texas A&M U.

U. of Maryland

Northwestern U.

Harvard U.

U. of California - Santa Barbara

U. of Pennsylvania

Ohio State U.

Arizona State U.

U. of Washington

Virginia Tech

Rice U.

Wisconsin won last year and Purdue the year before.

For more details on voting and winning prizes, visit the webpage.