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Purdue’s AEP Design Challenge

May 13, 2016
Congratulations again to the Boilermakers at Purdue University for winning our 2016 Engineering Bracket Challenge....

Congratulations again to the Boilermakers at Purdue University for winning our 2016 Engineering Bracket Challenge. They emerged from a distinguished group of 32 engineering schools as the top vote-getter and received recognition as one of the most admired engineering schools in the United States.

As a reward, all the engineering students at Purdue are eligible to participate in the “Connect the World Using IoT” design challenge, which is backed by three engineering powerhouses—Digi-Key, Texas Instruments, and TE Connectivity. The students have until June 4 to submit a design that works with the Internet of Things. The design must also incorporate a Texas Instruments TM4C123G Launch Pad, a microprocessor that works with a variety of peripherals and IoT applications, and at least one component from TE Connectivity, a company that makes sensors for pressure, position, humidity, and temperature. The students also have to save the design in Scheme-It from Digi-Key, an online schematic and block diagramming tool for electronic circuits

After June 4, a panel of judges made up of engineers from the sponsors and the Electronic Design and Machine Design editorial staffs will evaluate the submissions and award at least three prizes. First-place design wins an Apple Macbook Pro, second place earns an Apple iPad Air, and third place gets a GoPro Hero4 Session camera.

Once the competition is over, I will share the winning entries with you, along with some of the judges’ comments.

About the Author

Stephen Mraz Blog | Senior Editor

Steve serves as Senior Editor of Machine Design.  He has 23 years of service and has a B.S. Biomedical Engineering from CWRU. Steve was a E-2C Hawkeye Naval Flight Officer in the U.S. Navy. He is currently responsible for areas such as aerospace, defense, and medical.

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