Master Bond EP88FL

Key Features

  • Low viscosity
  • Moderately fast set-up time
  • Optically clear
  • High flexibility
  • Cryogenically serviceable
  • Resists thermal cycling and shock

Master Bond EP88FL is a low viscosity, optically clear, two-component epoxy system featuring good flexibility for high-performance bonding, coating, sealing, and potting. It features a forgiving one-to-one mix ratio by weight or volume. It cures readily at room temperature and will cure faster at elevated temperatures. The optimum cure is overnight at room temperature followed by 1 to 2 hours at 150°F to 200°F. The system is 100% reactive and does not contain any solvents or diluents.

EP88FL bonds well to a wide variety of substrates including metals, glass, ceramics, and many plastics. Since it is a flexible system, it is well suited for bonding dissimilar substrates. It has very good resistance to rigorous thermal cycling. Additionally it can withstand thermal and mechanical shocks. EP88FL has reasonably good chemical resistance to water, oils, fuels, and mild acids and bases. The combination of low viscosity and superb electrical insulation properties makes it a good option for potting and encapsulation.

Its service temperature range extends from 4K to 250°F. The color of both Part A and B is clear. EP88FL can be considered in applications involving optics, electronics, aerospace, and specialty OEM where the properties discussed here are desirable.

Product Advantages

  • Convenient handling
  • Low viscosity
  • Relatively faster setting
  • Outstanding optical clarity
  • First-rate electrical insulator
  • Highly desirable Shore D hardness range

Request More Information

By clicking above, I acknowledge and agree to Endeavor Business Media’s Terms of Service and to Endeavor Business Media's use of my contact information to communicate with me about offerings by Endeavor, its brands, affiliates and/or third-party partners, consistent with Endeavor's Privacy Policy. In addition, I understand that my personal information will be shared with any sponsor(s) of the resource, so they can contact me directly about their products or services. Please refer to the privacy policies of such sponsor(s) for more details on how your information will be used by them. You may unsubscribe at any time.