Sustainability and energy efficiency were among the key themes at this year's premier event for the packaging industry. Here are a few of the things attendees could see on the show floor in Las Vegas.
Sustainability and energy efficiency were among the key themes at this year's premier event for the packaging industry. Here are a few of the things attendees could seeon the show floor in Las Vegas. (For even more Pack Expo coverage, check out our videos at EngineeringTV.)
Lee Teschler served as Editor-in-Chief of Machine Design until 2014. He holds a B.S. Engineering from the University of Michigan; a B.S. Electrical Engineering from the University of Michigan; and an MBA from Cleveland State University. Prior to joining Penton, Lee worked as a Communications design engineer for the U.S. Government.