The OGN series open fuse holder for 5 × 20 mm fuses now offers a version that is compatible with Through-Hole Reflow (THR) solder processes, in addition to the existing THT and SMT versions. SMT components are used for PCB assemblies. Ideally, these components are compatible with solder reflow processes to fully automate the assembly. The solution is Through-Hole Reflow (THR) components, combining the features of PCB THT mounting with a component capable of withstanding the high thermal stress of a reflow oven.
The THR component is first printed into the pin vias, and then pushed through the solder paste. As the paste melts in the reflow oven, the liquid solder retracts into the vias, due to wetting and capillary forces, to form the solder joint. The series is rated 16 A at 500 V AC/V DC according to UL and CSA and 10/16 A at 500 V AC according to VDE. The series can be enclosed with an optional cover. Rated power acceptance according to IEC is 4 W/1 6A at Ta 23°C for the version without cover.