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    Thermally conductive epoxy

    Dec. 1, 2010
    EP30FLAO two-component epoxy resin is suitable for cryogenic applications and useful for potting, bonding, sealing, and coating

    EP30FLAO two-component epoxy resin is suitable for cryogenic applications and useful for potting, bonding, sealing, and coating.

    Features & benefits

    • Low viscosity, excellent flow; designed for electronic, electrical, computer, metalworking, appliance industries

    • 4K to 250° F; 9 to 10 BTU/in/ft2/hr/°F thermal conductivity

    • 5,000 to 6,000 cps at 75° F; low thermal expansion coefficient, superior dimensional stability, toughness; Parts A and B are available in half pint to five-gallon containers

    Master Bond
    (201) 343-8983
    masterbond.com

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