Content Semiconductor inspection, metrology, and advanced packaging require precise motion across increasingly demanding scan areas and process conditions. PI’s magnetic levitation technology demonstrators combine contact-free motion with active control of all six degrees of freedom: X, Y, Z, and rotation about each axis. The three platforms address different tasks, from picometer-class AFM scanning over millimeter ranges to long-travel wafer positioning with force control and continuous rotary inspection. Direct actuation allows motion errors to be corrected electronically while eliminating mechanical bearing contact, lubrication, and bearing wear. Three Platforms for Precision Motion Technology demonstrator Application focus Control Motion at the Process Point Active six-axis control provides a way to correct cross-axis motion, height, and tip/tilt errors within one motion platform. Depending on the demonstrator, it also supports force-controlled bonding, dynamic focus tracking, or programmable stiffness and damping. These capabilities help address measurement stability, settling time, and process consistency without stacking separate motion mechanisms. These systems are technology demonstrators. Performance values below describe the demonstrated configurations, unless identified as configuration dependent. Final specifications depend on the application and system design. Rotary MagLev Wafer Stage Video: Operation of the 6-DOF MagLev rotary stage demonstrator Continuous Rotation with Active Plane Control Axial, radial, and tilt errors during rotation can directly affect wafer inspection and metrology. This rotary demonstrator combines unlimited theta travel with active control of the rotor center and plane. Axial position and tip/tilt are stabilized throughout rotation to maintain the measurement plane. Independent actuation corrects parasitic motion, while repeatable error components can be characterized and compensated electronically. Corrective forces and moments also help suppress vibration, rotor imbalance effects, and process-induced disturbances. Fine positioning tilt error: <50nrad peak-to-peak 2kg demonstrated; up to 25kg with other configurations Tested step resolution of the MagLev rotary stage demonstrator, 200nrad step size Adapt Rotor Dynamics to the Measurement Programmable stiffness and damping allow the rotor response to be adapted for dynamic positioning or stable measurement. Contact-free, air-free rotation removes bearing friction, lubricant requirements, and compressed-air infrastructure, including air-pressure-dependent flying height. The 6-DOF MagLev linear stage demonstrator Video: 6-DOF MagLev linear stage demonstrator Wafer Positioning and Force Controlled Bonding Advanced packaging requires accurate alignment, fast positioning, and controlled process forces. This demonstrator integrates long-travel motion, nanometer-class stability, and force control in one levitated body. Low moving mass and direct actuation support high acceleration and short settling times. Angular alignment In-position stability >100N process force; mNforce resolution with an integrated force sensor Repeatability and crosstalk over the full Z stroke Measured position stability of the linear MagLev nanopositioning stage demonstrator, showing sub-nanometer RMS for XYZ and around 1nrad for ӨXYZ Inspection and Metrology on the Fly The same long-travel concept supports wafer inspection with active height control during scanning and correction of tip, tilt, and cross-axis errors. The inspection configuration demonstrates Z focus tracking above 200Hz, with <2nm peak-to-peak Z stability and <20nrad peak-to-peak angular stability. Different configurations can achieve acceleration to 6 g and velocity to 2,000mm/s. Bonding Z travel can reach 2,000µm; the inspection datasheet indicates focus travel of 2,000µm or more with other configurations. Video: MagLev scanner for AFM Sub-nanometer Scanning Across Millimeter Ranges Shrinking semiconductor features and advanced packaging structures require accurate surface measurements over larger fields of view. The MagLev AFM scanner combines ultra-high-resolution, piezo-class motion and millimeter travel in one contact-free stage, supporting picometer scanning resolution and long-range profiling at die level without stitching. Resolution In-position stability Positioning accuracy / repeatability test, and Z-error test of the MagLev AFM scanner demonstrator. The low 130pm Z-RMS error (after learning correction) is a very impressive figure for this prototype. Measured results include 2.8nm X-axis repeatability and 22.3nm accuracy over 5mm without calibration. With ILC, the scanner achieved 130pm RMS Z-jitter at 20mm/s over an 8mm scan. Other configurations can provide X/Y travel to 50mm, acceleration to 1g, and velocity to 100mm/s. The motion range can be scaled to the application, including wafer-level scanning and profiling. Whether your process requires high-resolution AFM scans, controlled bonding forces, or continuous rotary inspection, PI can discuss the motion range, payload, stability, dynamics, and control approach needed for your system. Compliance with Applicable Laws; Export Control Laws User access to this website is governed by all applicable federal, state, and local laws. All information available on this website is subject to U.S. export control laws and may also be subject to the laws of the country where you reside.