Thermal-conduction material

    April 19, 2011
    Hi-Flow 650P is a thermally conductive phase-change material for power supplies, IGBTs, discrete components, and automotive applications. It has excellent handling characteristics

    Hi-Flow 650P is a thermally conductive phase-change material for power supplies, IGBTs, discrete components, and automotive applications. It has excellent handling characteristics: With a polyimide film reinforcement, its top side is dry and its bottom side has a natural tack. The film reinforcement gives the material high dielectric strength and cut-through resistance. Hi-Flow 650P has a thermal impedance of 0.20°C-in.2/W at 25 psi. The material comes in sheet and bulk roll form with tabulated parts. Available thicknesses include 0.0045, 0.0050, and 0.0055 in.

    The Bergquist Co., 18930 W. 78th St., Chanhassen, MN 55317, (800) 347-4572, www.bergquistcompany.com

    © 2011 Penton Media, Inc.

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