Machine Design

Thermal-conduction material

Hi-Flow 650P is a thermally conductive phase-change material for power supplies, IGBTs, discrete components, and automotive applications. It has excellent handling characteristics: With a polyimide film reinforcement, its top side is dry and its bottom side has a natural tack. The film reinforcement gives the material high dielectric strength and cut-through resistance. Hi-Flow 650P has a thermal impedance of 0.20°C-in.2/W at 25 psi. The material comes in sheet and bulk roll form with tabulated parts. Available thicknesses include 0.0045, 0.0050, and 0.0055 in.

The Bergquist Co., 18930 W. 78th St., Chanhassen, MN 55317, (800) 347-4572,

© 2011 Penton Media, Inc.

TAGS: Archive
Hide comments


  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.