Sherlock Automated Design Analysis 4.0 software now includes Substrate Trace Modeling, Abaqus, and ANSYS Workbench for analyzing printed-circuit-board (PCB) designs and other complex components. Among the new features are an expanded suite of FEA integration tools, modeling for surface-mount and through-hole components, substrate trace modeling, shock scoring, an expanded cutout editor, and a heatsink editor.
Targeting next-generation IC packaging, Sherlock 4.0 can model coreless substrates, ultra-thin ball grid arrays (BGAs), multi-stack filled microvias, and 3D packaging. Sherlock’s Lead Modeler and Heatsink Creator specify lead structures and identify heatsink architecture. The Shock Scoring feature analyzes components that are repetitively exposed to shock, such as door and trunk-mount electronics in automotive applications and electronics worn in athletic gear. “One Sherlock customer recently estimated a six month reduction in time to market and an annual savings of $7.6M,” claims DfR Solutions CEO, Craig Hillman.