The PowerSite attachment lets power semiconductors mount directly onto heat sinks without mechanical fasteners. The PowerSite process selectively bonds insulated copper pads onto aluminum heat sinks. A high-temperature adhesive, coated on both sides of a 1-mil Kapton MT film, laminates 1-oz copper foil pads to aluminum heat sinks. Each copper pad provides an interface with thermal impedance as low as 0.1°C-in.2/W. The thermal performance can lower device junction temperatures, reduce heat-sink size, increase power capacity, or increase the ambient temperature rating.
Chomerics, div. of Parker Hannifin Corp., 77 Dragon Court, Woburn, MA 01888, (781) 935-4850.