The
PowerSite attachment lets power semiconductors mount directly onto heat sinks
without mechanical fasteners.
The PowerSite attachment lets power semiconductors mount directly onto heat sinks without mechanical fasteners. The PowerSite process selectively bonds insulated copper pads onto aluminum heat sinks. A high-temperature adhesive, coated on both sides of a 1-mil Kapton MT film, laminates 1-oz copper foil pads to aluminum heat sinks. Each copper pad provides an interface with thermal impedance as low as 0.1°C-in.2/W. The thermal performance can lower device junction temperatures, reduce heat-sink size, increase power capacity, or increase the ambient temperature rating.
Chomerics, div. of Parker Hannifin Corp., 77 Dragon Court, Woburn, MA 01888, (781) 935-4850.
