Formulations of Silk semiconductor low- dielectric for 300-mm semiconductor manufacturing handle processing changes needed to reach uniform, stable films on large-diameter wafers.
Formulations of Silk semiconductor low- dielectric for 300-mm semiconductor manufacturing handle processing changes needed to reach uniform, stable films on large-diameter wafers. Silk resins help increase chip speed and performance by providing greater density. First-generation Silk resins offer of 2.6 for copper damascene and aluminum/tungsten processing.
Dow Chemical Co., Box 1206, Midland, MI 48641, (800) 441-4369.
Exploring industrial drives, power supplies, and energy solutions to reduce peak power usage and installation costs, & to promote overall system efficiency
SEW-EURODRIVE's VFDs and gearmotors enhance timber resawing by delivering precise, efficient cuts while reducing equipment stress. Upgrade your sawmill to improve safety, yield...
