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    Low-K resin for 300-mm process modules

    July 11, 2001
    Formulations of Silk semiconductor low- dielectric for 300-mm semiconductor manufacturing handle processing changes needed to reach uniform, stable films on large-diameter wafers.

    Formulations of Silk semiconductor low- dielectric for 300-mm semiconductor manufacturing handle processing changes needed to reach uniform, stable films on large-diameter wafers. Silk resins help increase chip speed and performance by providing greater density. First-generation Silk resins offer of 2.6 for copper damascene and aluminum/tungsten processing.

    Dow Chemical Co., Box 1206, Midland, MI 48641, (800) 441-4369.

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