Thermal Pad for Delicate Electronics

    Nov. 18, 2010
    Gap Pad VO Ultimate is a highly conformable, elastic, thermal material that provides excellent interfacing and wet-out characteristics

    Gap Pad VO Ultimate is a highly conformable, elastic, thermal material that provides excellent interfacing and wet-out characteristics. The fiberglass-reinforced, silicone-based material decreases stress on fragile electronic component leads and solder balls. The side with the fiberglass carrier allows for ease of rework, good handling qualities, and puncture resistance. The material comes in 20 to 125-mil thicknesses in sheet form or as die-cut parts.

    Bergquist Co.
    18930 West 78th St.
    Chanhassen, MN 55317
    (800) 347-4572
    www.bergquistcompany.com

    © 2010 Penton Media, Inc.

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