These flexible-printed circuits have SMT capabilities for component assembly on both prototypes and full-production runs. This process can accommodate package sizes down to 0402 and 0.5 mm pitch-leaded packages.
Polyimide or epoxy-glass stiffeners can be laminated in place for additional support and strain relief. Laser processing, used in board manufacture, supports precision drilling down to 0.002 in. diameters for micro-via and blind-via-multilayer circuits.
The shift of some of our transport traffic from the road to the air through urban air mobility is one of the most exciting future fields in the aerospace industry.
Eight Bachelor students built a flying manipulator that can hover in any orientation and grasp objects. The drone is even more maneuverable than a quadrocopter and was designed...
IDX drives combine power with small space requirements - a brushless BLDC motor combined with an EPOS4 positioning controller and a gearhead inside a high-quality industrial housing...
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