These flexible-printed circuits have SMT capabilities for component assembly on both prototypes and full-production runs. This process can accommodate package sizes down to 0402 and 0.5 mm pitch-leaded packages.
Polyimide or epoxy-glass stiffeners can be laminated in place for additional support and strain relief. Laser processing, used in board manufacture, supports precision drilling down to 0.002 in. diameters for micro-via and blind-via-multilayer circuits.
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