These flexible-printed circuits have SMT capabilities for component assembly on both prototypes and full-production runs. This process can accommodate package sizes down to 0402 and 0.5 mm pitch-leaded packages.
Polyimide or epoxy-glass stiffeners can be laminated in place for additional support and strain relief. Laser processing, used in board manufacture, supports precision drilling down to 0.002 in. diameters for micro-via and blind-via-multilayer circuits.
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An innovative aircraft with electric drives combines the best of both worlds. The cross between drone and helicopter could mean significantly faster and more efficient air emergency...
Effective when other materials fail, ceramics are particularly suitable for applications requiring wear and chemical resistance, sliding characteristics or biocompatibility. Discover...
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