Flexible Circuit Materials

June 16, 2005
R/flex AP 200 is an all-polyimide 2LFCCL circuit material.

Bonding polyimide onto adhesion-treated copper foil without conventional adhesives makes it. They serve as thin multilayer and rigidflex circuits in cell phone hinge flex, LCD interconnects, and other handheld electronic devices.

Rogers Corp.,
Box 188, One Technology Dr., Rogers, CT 06263,
(860) 779-4045,
rogerscorporation.com

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