CFD Models Chip Thermals

May 24, 2007
V9 of CFdesign includes compact thermal models that let users find temperatures in microchips during system operation.

Only two parameters are needed to supply temperatures for boards, junctions, and cases, and heat transfers between junction and board, and between junction and case for every component within the system. The software specifies properties of each copper and dielectric (FR-4) layer, and computes and applies conductivities in the simulation. Users can add characterized PCBs to the material library for reuse.

CFdesign Inc., 3315 Berkmar Dr., Charlottesville, VA 22901,

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