EP37-3FLFAN, a thermally conductive and electrically insulative potting compound, is designed for applications requiring a dielectric heat-transfer adhesive
EP37-3FLFAN, a thermally conductive and electrically insulative potting compound, is designed for applications requiring a dielectric heat-transfer adhesive. This two-part epoxy is strong and has a high degree of flexibility that holds up well to temperatures up to 250°F and in cryogenic environments down to 4K. The adhesive features a 25-Btu thermal conductivity and a 1 × 1014-Ω-cm volume resistivity. The compound cures at room temperature and forms tough bonds that resist shock, impact, thermal cycling, and chemicals.
Master Bond 154 Hobart St. Hackensack, NJ 07601 (201) 343-8983 masterbond.com