Cryogenic Epoxy for Wind-Tunnel Bonding Aapplications

    Sept. 8, 2009
    The EP21TCHT-1 two-part cryogenic epoxy adhesive is for the assembly of difficult-to-bond substrates used in state-of-the-art wind tunnels.

    The EP21TCHT-1 two-part cryogenic epoxy adhesive is for the assembly of difficult-to-bond substrates used in state-of-the-art wind tunnels. The epoxy has a 2,200-psi shear bond strength at ambient temperatures up to 400°F and low-temperature cryogenic environments down to 4°K. The bonds are resistant to thermal cycling and many chemicals. The high thermal conductivity of the hardened adhesive is useful in the tunnel’s overall temperature cycling performance.

    Master Bond Inc.
    154 Hobart St,
    Hackensack, NJ 07601
    (201) 343-2132
    www.masterbond.com

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