New Products: Thermal-management epoxy

Aug. 19, 2009
EP30BN two-part, boron-nitride epoxy adhesive helps with thermal management.

EP30BN two-part, boron-nitride epoxy adhesive helps with thermal management for aerospace, defense, and microelectronic assemblies. The epoxy's medium viscosity lets it flow in bonding, sealing, and potting applications.

It has a specific gravity of 1.1 and cures at room temperature or elevated temperatures. The epoxy works between -60 and 300°F. Its volume resistivity is over 1014 ohm-cm, and it has a thermal conductivity of 24 BTU/hr/ft2/°F/in.

Master Bond
154 Hobart St.,
Hackensack, NJ 07601
(201) 343-8983

About the Author

Jessica Shapiro

Jessica serves as Associate Editor - 3 years service, M.S. Mechanical Engineering, Drexel University.

Work experience: Materials engineer, The Boeing Company; Primary editor for mechanical and fastening & joining.

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