Master Bond EP21TDCS-LO two-part, electrically conductive, silver-filled epoxy passes NASA low-outgassing specifications. It cures at room temperature in 24 to 48 hr or at 200°F in 1 to 2 hr. It has tensile shear strength over 1,800 psi and T-peel strength over 5 pli. The volume resistivity of the system is less than 10-3 ohm-cm, and it works between 4K and 275°F and in chemicals, including water, oil, and most organic solvents. The epoxy mixes at 1:1 by weight or volume. It can be applied to vertical surfaces without sagging, and only contact pressure is required for curing.
