Bilevel edgecard connectors, for high-temperature applications, have staggered, dip-solder contacts.
The connectors feature 0.050-in. contact center spacing, are backwards compatible with 0.100-in. center-spacing devices to double the number of contacts within the same space, have 3-A single-contact current rating, 0.75-N single-contact normal force, and 5,000 MΩ minimum insulation resistance at 125 Vdc,
The connectors are designed to accommodate the interconnection of 0.062-in. ±0.008-in. daughtercards in communication systems, medical equipment, instrumentation, and automotive R&D. For severe high-temperature environments, the devices come with BeCu (beryllium-copper) pins and PPS/PA9T insulators for operation in –65 to 150°C. Sullins Electronics Corp., 801 E. Mission Rd., San Marcos, CA 92069, (888) 774-3100, sullinselectronics.com
