Machine Design

Tra-Bond 2158 Adhesive

Tra-Bond 2158 is for applications requiring a flexible thermally conductive adhesive.


The material is a room-temperature curing system (with the option of a heat cure) that provides strong, durable bonds and withstands high impact. Tra-Bond 2158 has a thermal conductivity of 0.84 W/M/K, and its coefficient of expansion works well with a variety of substrates over a wide temperature range. Free samples are available.

Tra-Con Inc.,
45 Wiggins Ave., Bedford, MA 01730,
(800) 872-2661,

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