Through-Hole Reflow Assembly Process Pioneered by Wieland Electric Strengthens Connections to Printed-Circuit Boards

June 22, 2010
Through-hole reflow assembly strengthens connections to printed-circuit boards and works with automation equipment
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Through-hole reflow (THR) is a recently developed method of attaching components to printed-circuit boards built with solder-reflow processing. In fact, THR and surface-mount devices (SMD) can be handled at the same time and on the same equipment. This could make wave soldering obsolete and save manufacturers up to 40% on the cost of connecting components to circuit boards.

One company pioneering this new process is Wieland Electric GmbH, a German firm with U.S. headquarters in Burgaw, N.C. ( They say THR makes strong connections to PC boards, letting electrical components better withstand mechanical loads. THR has been shown to create bonds much stronger than those made using surface-mount technology (SMT). This means THR components, particularly terminal blocks and connectors, can withstand the mechanical forces required during termination and header-and-plug-mating processes. Components can be delivered in trays or tape and reel, so they are suitable for pick-and-place automation as well.

Wieland Electric offers THR connectors in 3.5, 3.81, 5.0, and 5.08-mm pitches for both two-piece connectors and one-piece terminal blocks.

Edited by Stephen J. Mraz

© 2010 Penton Media, Inc.

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