The Clash between IPC Class 3 Requirements and Shrinking Geometries Sponsored by VersaLogic
Learn what makes embedded computer hardware more reliable. Examine the link between circuit board layout, and long-term reliability in the field. With the advent of high density fine-pitch BGA packages, new design and manufacturing challenges need to be addressed. Download this white paper to learn about the challenges faced in meeting high reliability requirements, and how companies like VersaLogic are producing ultra-reliable embedded computers.
