The PE-100 Convertible plasma system incorporates reactive ion etching and isotropic etching/cleaning technologies into a stand-alone benchtop system. The all aluminum chamber has over 240 in.2 of active processing surface with the three-level standard configuration. The unit has directional electrodes for reactive ion etching for drilling microvias or cleaning small variations that can't be reached with chemicals. The isotropic etching/cleaning mode isn't directional.