Dual-mode plasma etching system - Plasma Etch

    Oct. 14, 2011
    The system can perform both anisotropic reactive ion etching and isotropic etching/cleaning.

    The PE-100 Convertible plasma system incorporates reactive ion etching and isotropic etching/cleaning technologies into a stand-alone benchtop system. The all aluminum chamber has over 240 in.2 of active processing surface with the three-level standard configuration.
    The unit has directional electrodes for reactive ion etching for drilling microvias or cleaning small variations that can't be reached with chemicals. The isotropic etching/cleaning mode isn't directional.

    Plasma Etch, 3522 Arrowhead Dr., Carson City, NV 89706, (775)883-1336,  www.plasmaetch.com

    About the Author

    Jessica Shapiro

    Jessica serves as Associate Editor - 3 years service, M.S. Mechanical Engineering, Drexel University.

    Work experience: Materials engineer, The Boeing Company; Primary editor for mechanical and fastening & joining.

    Continue Reading

    Sponsored Recommendations

    June 27, 2025
    Ensure workplace safety and compliance with our comprehensive Lockout/Tagout (LOTO) Safety Training course. Learn critical procedures to prevent serious injuries.
    June 27, 2025
    Join our expert webinar to discover essential safety control measures and best practices for engineering a truly safe and compliant industrial environment.
    June 25, 2025
    An innovative aircraft with electric drives combines the best of both worlds. The cross between drone and helicopter could mean significantly faster and more efficient air emergency...
    June 25, 2025
    Effective when other materials fail, ceramics are particularly suitable for applications requiring wear and chemical resistance, sliding characteristics or biocompatibility. Discover...

    Voice your opinion!

    To join the conversation, and become an exclusive member of Machine Design, create an account today!