Dual-mode plasma etching system - Plasma Etch

Oct. 14, 2011
The system can perform both anisotropic reactive ion etching and isotropic etching/cleaning.

The PE-100 Convertible plasma system incorporates reactive ion etching and isotropic etching/cleaning technologies into a stand-alone benchtop system. The all aluminum chamber has over 240 in.2 of active processing surface with the three-level standard configuration.
The unit has directional electrodes for reactive ion etching for drilling microvias or cleaning small variations that can't be reached with chemicals. The isotropic etching/cleaning mode isn't directional.

Plasma Etch, 3522 Arrowhead Dr., Carson City, NV 89706, (775)883-1336,  www.plasmaetch.com

About the Author

Jessica Shapiro

Jessica serves as Associate Editor - 3 years service, M.S. Mechanical Engineering, Drexel University.

Work experience: Materials engineer, The Boeing Company; Primary editor for mechanical and fastening & joining.

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