SEMICON West highlights latest technologies

July 1, 2012
Recent developments in 22 nm process development and lithography the next Moore's Law progression, and the next target for the International Technology

Recent developments in <22 nm process development and lithography — the next Moore's Law progression, and the next target for the International Technology Roadmap for Semiconductors (ITRS) — will be featured in presentations and technical sessions during SEMICON West, July 10 to 12 in San Francisco. Shekhar Borkar, director of Extreme-scale Technologies at Intel Labs, will provide the technology keynote on Tuesday morning, discussing Intel's IC development efforts in scaling, power reduction, and performance improvements. Separate two-hour sessions will be held on the latest technical achievements, challenges and barriers in photolithography, and advanced materials and processes for <22 nm production.

Mobile and cloud computing are among the key drivers of the semiconductor industry. With conventional scaling approaching its physical limits, the challenge will fall to advanced materials and processes — as well as transistor architectures — to continue driving development of faster, smaller, and thinner devices. The South Hall TechXPOT session at 10:30 a.m. on July 10 will examine trends and issues with fully depleted devices and the use of III-V channel materials. Lithography challenges represent the single biggest threat to the continuation of Moore's law; the latest achievements, technology roadmaps, and development efforts will be discussed at 10:30 a.m. on July 11 in the South Hall TechXPOT session.

This year, SEMICON West is integrating ITRS sessions into the TechXPOT and Extreme Electronics platforms on July 12. Other technical sessions will address new materials, advances in 3D-IC, MEMS, test, advanced packaging, LEDs, OLEDs, and productivity solutions for 200 and 300-mm fabs.

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