Machine Design
  • Resources
  • Members
  • Directory
  • Webinars
  • WISE
  • CAD Models
  • Advertise
    • Search
  • 3D Printing & CAD
  • AUTOMATION & IIOT
  • Robotics
  • Motion Systems
  • Materials
  • Video
  • Data Sheets
  • Topics
    Industry Markets3D Printing & CADAutomation & IIoTFastening & JoiningMaterialsMechanical & Motion Systems Medical DesignRobotics
    Resources
    Machine Design ResourcesWISE (Workers in Science & Engineering)Company DirectorySearch Data SheetsContributeDigital Edition ArchivesCSIA Exchange
    Members
    ContentBenefitsSubscribe
    Advertise
    https://www.facebook.com/MachineDesignMagazine/
    https://www.linkedin.com/company/10998894
    https://twitter.com/MachineDesign
    https://www.youtube.com/channel/UCXKEiQ9dob20rIqTA7ONfJg
    1. News

    Integrated cooling system lets chips beat the heat

    July 21, 2005
    Ever-increasing power density in highperformance ICs has pushed the limits of conventional cooling methods such as heat sinks and fans.
    Lawrence Kren

    But a technique that puts liquid-cooling channels onto the backs of ICs could significantly boost cooling rates and make 3D chips more practical, say developers at the Georgia Institute of Technology

    Some existing liquid-cooling technology uses high-temperature bonding to attach separate cooling modules or build microchannels onto chip backs. But modules have limited heat-transfer rates, and bonding temperatures of 400 to 700°C can damage circuits. In contrast, Georgia Tech's CMOS-compatible technique works at temperatures <260°C and builds microfluidiccooling channels without damaging attached circuits. The scheme works on gigascale integrated (GSI) chips and is fully compatible with conventional flip-chip packaging.

    Researchers begin by etching trenches about 100- m deep on back of a silicon wafer. A sacrificial layer of high-viscosity polymer fills in the trenches. Next, a polishing step removes excess polymer. A porous overcoat covers the filled trenches and the chip is gradually heated in a nitrogen atmosphere. The heating decomposes the sacrificial-polymer, leaving behind the microfluidic channels. The porous overcoat is then covered with another polymer layer to make a watertight system. Buffered, deionized water acts as a coolant.

    Self-contained systems would employ tiny micropumps to circulate coolant, while more complex equipment could use a centralized circulation system. Microchannels have been shown to withstand pressures exceeding 35 psi and should be capable of cooling rates of 100 W/cm2. Cooling capacity depends on coolant flow rate, pressure, and channel size. Smaller diameter microchannels more efficiently transfer heat than larger ones. Researchers have also built through-chip holes and polymer pipes that would connect an on-chip cooling system to channels embedded in a printed-circuit board.

    The technology will probably first find use in high-performance specialty processors. So far, the tiny cooling systems have run for several hours without failure, though additional testing is still needed. Funding for the research comes from the Microelectronics Advanced Research Corp. and Darpa.

    Continue Reading

    The Future of Connected Worker Technology and Its Impact on Industrial Training

    Markforged Offers its FX10 Industrial 3D Printer for Enhanced Factory Operations

    Sponsored Recommendations

    Smart Factory Solutions that Connect and Protect from Amphenol RF

    Nov. 28, 2023

    Stay Connected and In Control of Your Future Factories with Littelfuse

    Nov. 28, 2023

    Turn to NKK Switches for the Widest Range of Industrial-Savvy Electromechanical Switches

    Nov. 28, 2023

    Unlocking Operational Flexibility in Manufacturing with Industria IoT

    Nov. 28, 2023

    Voice your opinion!

    To join the conversation, and become an exclusive member of Machine Design, create an account today!

    I already have an account

    New

    A Beginner’s Guide to Design Failure Mode and Effects Analysis (DFMEA)

    Deliver Robust Automated Systems Through Servo Maintenance

    How a Connected World Requires Product Adaptation and Faster Time-to-Market

    Most Read

    For Better or For Worse, Multimodal AI Cultivates New Frontiers

    Brushed vs Brushless Motors: Which is Best for your Application?

    Why it’s Time to Replace Hydraulic and Pneumatic Actuators with Electric Cylinders

    Sponsored

    Power Supplies

    THINKING INSIDE THE BOX: ENCLOSURES

    ULTIMATE BATTERY CARE

    Machine Design
    https://www.facebook.com/MachineDesignMagazine/
    https://www.linkedin.com/company/10998894
    https://twitter.com/MachineDesign
    https://www.youtube.com/channel/UCXKEiQ9dob20rIqTA7ONfJg
    • About Us
    • Contact Us
    • Advertise
    • Do Not Sell or Share
    • Privacy & Cookie Policy
    • Terms of Service
    © 2023 Endeavor Business Media, LLC. All rights reserved.
    Endeavor Business Media Logo