Tactilus heat-sink analysis system measures contact force and pressure distribution between heat sinks and semiconductors to ensure efficient heat conduction. The system's Windows-based software creates pressure vs. time graphs and histograms; renders and scales 2D, 3D, and 360° images; and works with Excel, ASCII, and Access report formats.
The flexible sensors resist electromagnetic noise, temperature, and humidity fluctuations and are 0.015-in. thick with a 25-by-25 grid of resistive sensing points over a 2-in. square. Scan speeds are up to 1,000 Hz, operating pressures range from 0 to 100 psi. Accuracy is ±10%; repeatability is ±2%; hysteresis is ±5%; and non-linearity is ±1.5%.
Sensor Products Inc., 300 Madison Ave., Madison, NJ 07940, (973) 884-1755, www.sensorprod.com/dynamic/heatsink
About the Author
Jessica Shapiro
Jessica serves as Associate Editor - 3 years service, M.S. Mechanical Engineering, Drexel University.
Work experience: Materials engineer, The Boeing Company; Primary editor for mechanical and fastening & joining.