New burn-in sockets for chip-scale packaged (CSP) integrated circuits are said to be the first such devices that are molded rather than machined out of block plastic.
Only some secondary machining operations are needed on the molded versions, says their manufacturer Aries Electronics Inc., Frenchtown, N.J. (arieselec.com) This drastically reduces the price of the test sockets, claims Aries. The sockets mount and detach from burn-in boards via solderless pressure-mount compression spring probes. A springloaded, cam-actuated pressure pad holds ICs during tests.