Gap Pad VO Ultimate thermal-management pads remain conformable and elastic, even on highly rough or uneven surfaces.
Gap Pad VO Ultimate thermal-management pads remain conformable and elastic, even on highly rough or uneven surfaces. The fiberglass-reinforced, silicone-based material can lower stress on fragile electronics component leads and solder balls. The fiberglass carrier on one side simplifies rework and is slightly tacky to minimize shifting during assembly. The pads are offered in standard thicknesses of 20 to 125 mil in sheet form or as die-cut parts of most any shape or size.
