With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound...

The selection process of an adhesive, coating or potting compound can pose a few challenges for engineers. Some of these include adhesion, temperature and thermal cycling resistance...

Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. This NASA low outgassing approved system cures at the low temperature of 80˚C and...

Master Bond formulates high-quality, innovative compounds for the laser, optics, and photonics industries. Our goal is to help engineers meet specific requirements for their bonding...

Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition...

Master Bond EP30HT-LO is a moderate-viscosity, two-component, epoxy system that can be cured at room temperature, or at elevated temperatures for a faster cure. It can bond to...

Overview Master Bond UV10TKLO-2 is a one-component UV-curable system for high-performance bonding, sealing, and encapsulation applications. It meets NASA’s specifications...

Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product...

Conductive bonding agents play a fundamental role in ensuring reliable electrical connectivity in many electromechanical assemblies designed to operate at the extremes of temperature...

When determining the most effective adhesive to be used in opto-electronics, medical and other optic related industry applications, trade-offs of key characteristics should be...