Photochemically etched surface-mount and insertmount lead frames are for use in integrated circuit manufacturing.
Base materials include Kovar, nickel-iron and copper alloys, and pure nickel. Leadfree plating materials include silver, nickel, gold, or tin. High-density lead frames with acute profiles and ultrafine pitches allow for high pin counts. Single or double- sided lead frames can be etched without incurring the stresses caused by typical machining methods. Lead frames range in thickness from 0.0127 to 1.575 mm, with features as small as 0.10 mm on 0.254-mm centers.
