-flex 300 Series is a highly compressible, thermally conductive, and electrically insulating gap filler for use in computer and telecommunication devices.
T The ultrasoft material features a thermal conductivity of 1.2 W/mK and reportedly the lowest compression set of any gap filler currently available. It comes in 0.25 to 5-mm thickness and conforms with minimal pressure, resulting in little or no stress on adjoining parts. The material is naturally tacky and needs no additional adhesive coatings. It can be outfitted with a permanently attached metallized liner to provide a low-friction surface for simpler rework and assembly.
