A new line of advanced micro-USB plugs and sockets feature up to 4.8-Gbps data transfer speeds. These sockets reduce PCB footprints and support On-the Go technology for mobile-device connectivity without a host computer.
The new USB 2.0 and USB 3.0 products withstand greater than 10,000 mating cycles. The unit’s micro configuration provides the smallest PCB footprint of all USB interconnects. The products feature a special socket lead-in design for blind-mating with the plug. The plugs and sockets have gold-plated contacts.
